METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING PASTE AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD

摘要

A method of manufacturing a printed circuit board is provided to increase integration of a circuit pattern by using a silver paste and carbon paste. In a method of manufacturing a printed circuit board, a conductive pattern is formed at the end of a substrate(100). A plurality of holes is formed on the substrate. The paste pattern is extended from the top of the conductive pattern of a via hole to the bottom of the substrate along internal of the via hole. A top insulating layer(130') cover the top of the substrate while including the top of the paste pattern and the conductive pattern. A first bottom insulating layer(141) covers the bottom of the substrate together with the bottom of the paste pattern. The paste layer is formed at a part of the first bottom insulating layer. The second insulating layer(142) covers the bottom of the paste, the first bottom insulating layer, and a paste layer.