| 摘要 |
PROBLEM TO BE SOLVED: To provide a conditioning method and a conditioning device for a polishing pad, capable of uniformly planarizing the entire polished surface of a substrate by suppressing the reduction of a polishing speed on the center of the polished surface of the substrate.SOLUTION: The method for conditioning a polishing pad 2 on a polishing table 1 slid into contact with a thin film formed on the surface of a substrate W to polish the thin film by using a dresser 22 includes setting a receipt adjusting the moving speed of the dresser 22 for each region of the polishing pad 2 as a standard movement receipt, setting the moving speed of the dresser 22 moved between the center and the outer peripheral part of the polishing pad 2 to dress the polishing pad 2 larger in the predetermined region A2 of the polishing pad 2 than that in a predetermined region A2 in the standard movement receipt to perform conditioning of the polishing pad 2, and increasing the polishing speed of the thin film on the substrate W slid into contact with the predetermined region A2 of the polishing pad 2 to be polished.SELECTED DRAWING: Figure 3 |
