| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin paste excellent in low warpage property, flexibility, adhesion with a sealant, solvent resistance and chemicals resistance, heat resistance, electrical characteristics, humidity resistance, workability and profitability necessary for a protecting film of a flexible wiring board, while maintaining insulation reliability of a fine pitch wiring under a high temperature-high humidity condition; and a flexible wiring board using the same. SOLUTION: This thermosetting resin paste comprising a thermosetting resin and inorganic fine particles and used for a wiring board comprises (A) 100 parts by weight of a thermosetting resin and (B) 10 to 1,000 parts by weight of inorganic fine particles having an average particle diameter less than the half of the distance between two wirings of a wiring board. COPYRIGHT: (C)2007,JPO&INPIT
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