发明名称 STRUCTURE FOR RADIATING HEAT OF MEMORY IN PORTABLE COMPUTER THROUGH CONDUCTION AND CONVECTION
摘要 PURPOSE: A structure for radiating heat of a memory in a portable computer through conduction and convection is provided to discharge the heat generated from a memory module by installing a heat sink between the memory module and a memory cover, and largely improve operation reliability of the memory module by smoothly discharging the heat through the conduction/convection. CONSTITUTION: A memory slot(35) is formed by penetrating a case(32) at one side of a main body(30) and receives the memory module(38) at the inside. The memory cover(40) blocks the memory slot by being received to a penetrated part of the case. The heat sink(50) discharges the heat generated from the memory by being installed between the memory cover and the memory of the memory module.
申请公布号 KR20050017940(A) 申请公布日期 2005.02.23
申请号 KR20030055523 申请日期 2003.08.11
申请人 LG ELECTRONICS INC. 发明人 KIM, YE YONG
分类号 G06F1/16;(IPC1-7):G06F1/16 主分类号 G06F1/16
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