发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board free from short-circuiting even with a gap of a conductor circuit getting narrow. SOLUTION: The printed wiring board has a flat conductor circuit whose gap is narrower than a conductor width. A method of manufacturing the printed wiring board includes steps of: applying a liquefied resist to a metallic foil with a carrier layer; laminating a dry film resist including the same ingredients as those of the liquefied resist on the liquefied resist; exposing/developing the liquefied resist and the dry film resist to form a plated resist; depositing metal plating to serve as a conductor in an opening of the plated resist; and peeling the plated resist to form the conductor. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269708(A) 申请公布日期 2006.10.05
申请号 JP20050085259 申请日期 2005.03.24
申请人 CMK CORP 发明人 SHIMIZUDANI CHIHIRO
分类号 H05K3/20;H05K1/02 主分类号 H05K3/20
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