发明名称 PATTERN EVALUATION METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To highly accurately and rapidly evaluate a pattern even with a narrow width of tolerance data. SOLUTION: A pattern evaluation method includes steps of acquiring outline data of a pattern to be evaluated from a SEM image, calculating an inclination of the pattern from the acquired outline data, correcting difference in a rotation angle between design data and the outline data of the pattern based on the calculated inclination, comparing the corrected design data with the outline data, and determining whether or not a shape of the pattern to be evaluated is good from the comparison results. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269710(A) 申请公布日期 2006.10.05
申请号 JP20050085290 申请日期 2005.03.24
申请人 TOSHIBA CORP 发明人 MIYANO YUMIKO;MITSUI TADASHI
分类号 H01L21/66;H01J37/22 主分类号 H01L21/66
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