FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD

摘要

Provided is a method for manufacturing a flexible laminated board, comprising: a step for continuously feeding an insulating film (11) comprising a liquid crystal polymer, and a metal foil (12), between endless belts (23, 24); and a step for thermocompression bonding of the insulating film (11) and the metal foil (12) between the endless belts (23, 24). The thermocompression step involves heating a flexible laminated board (10) so that the maximum temperature of the flexible laminated board (10) is within a range from 45°C lower than the melting point of the liquid crystal polymer to 5°C lower than the melting point, inclusive; and slow-cooling the flexible laminated board (10) such that the exit temperature of the flexible laminated board (10), which is the temperature when conveyed out from between the endless belts (23, 24), is within a range from 235°C lower than the melting point of the liquid crystal polymer to 100°C lower than the melting point, inclusive.