| 发明名称 |
Method For Silver Plating |
| 摘要 |
The invention provides a method for silver plating using a non-cyanide acid silver plating bath to form a silver plating film exhibiting good adhesiveness while suppressing dissolution of resist in pattern plating. The method includes conducting strike plating using a non-cyanide acid strike plating bath prior to the silver plating.
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| 申请公布号 |
US2007284258(A1) |
申请公布日期 |
2007.12.13 |
| 申请号 |
US20070759417 |
申请日期 |
2007.06.07 |
| 申请人 |
YOSHIMOTO MASAKAZU;KITAMURA SHINGO;OMORI SEIJI;KADOKAWA TOSHIFUMI |
发明人 |
YOSHIMOTO MASAKAZU;KITAMURA SHINGO;OMORI SEIJI;KADOKAWA TOSHIFUMI |
| 分类号 |
C25D3/46 |
主分类号 |
C25D3/46 |
| 代理机构 |
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