发明名称 |
METHOD FOR COHESIVELY BONDING METAL TO A NON-METALLIC SUBSTRATE |
摘要 |
A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.
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申请公布号 |
US2008217379(A1) |
申请公布日期 |
2008.09.11 |
申请号 |
US20080045347 |
申请日期 |
2008.03.10 |
申请人 |
ABRAMOVICI EUGEN;GEVERS DAVID E;SILVIAN LUCIAN M |
发明人 |
ABRAMOVICI EUGEN;GEVERS DAVID E.;SILVIAN LUCIAN M. |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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地址 |
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