Semiconductor component of semiconductor chip size with flip-chip-like external contacts

摘要

A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.

主权项

1. A semiconductor component blank comprising:
an auxiliary carrier defining a plurality of component positions arranged in rows and columns on the auxiliary carrier, wherein the auxiliary carrier includes a first carrier surface and a second carrier surface opposite the first carrier surface; and a plurality of semiconductor components, wherein each semiconductor component comprises a semiconductor chip including: an active upper side, a rear side, a first side edge, and a second side edge, a plurality of solder balls disposed on the active upper side such that the solder balls project from the active upper side of the semiconductor chip to orient the active upper side in spaced relation from the auxiliary carrier, and a separate lead-free solder deposit disposed around a portion of each solder ball such that each separate solder deposit is spaced apart from the active upper side by the corresponding solder ball, each separate solder deposit coupling one of the solder balls to the first carrier surface of the auxiliary carrier, wherein the semiconductor chip is encapsulated by a plastic compound on at leak the rear side, the first side edge, and the second side edge, and wherein the solder balls and the separate solder deposits are embedded in the same plastic compound as the semiconductor chip such that an exposed external surface of each separate solder deposit is coplanar with a surface of the plastic compound and each f the solder balls is encased within the plastic compound.