| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a capacitor embedded interposer capable of transmitting a signal at a high speed and reducing high-frequency noise, while avoiding the complexity of manufacturing processes, a semiconductor device equipped with the same, and a manufacturing method for the capacitor embedded interposer. <P>SOLUTION: With respect to electrode pads 10 for a semiconductor integrated circuit element, some of electrode pads S for signal transmission are connected to Ti film 3. Other electrode pads S for signal transmission are connected to electrode pads 11 via routing wirings in a multi-layered wiring 9. Electrode pads V1 and V2 for power supply are connected to electrode pads 11, to which power lines of different potentials are connected via routing wirings. Furthermore, the electrode pads V1 and V2 are connected to Al foil 7a (anode). An electrode pad G for grounding is connected to an electrode pad 11, to which a ground line is connected via routing wiring. Furthermore, an electrode pad G is connected to a conductive polymer film 7c (cathode). <P>COPYRIGHT: (C)2009,JPO&INPIT |
