发明名称 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip
摘要 A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.
申请公布号 US2005039945(A1) 申请公布日期 2005.02.24
申请号 US20040902265 申请日期 2004.07.30
申请人 MATSUDA ATSUSI;OHAZAMA HIDETAKA 发明人 MATSUDA ATSUSI;OHAZAMA HIDETAKA
分类号 H01L21/60;H01L23/498;H05K1/02;H05K1/11;H05K1/18;H05K3/34;(IPC1-7):H05K1/00 主分类号 H01L21/60
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