| 摘要 |
A semiconductor component includes a substrate with an active side that includes connection regions disposed thereon. A die includes an upper metallization layer disposed over an upper surface. Integrated circuitry is disposed at the upper surface of the die and a passive side of the die is disposed on the active side of the substrate. The die includes exposed metal patterns at the level of its upper surface side. The exposed metal patterns are deformed in such a way that ends of the exposed metal patterns are connected to the connection regions of the substrate.
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