Method and apparatus for automatically positioning electronic die with component packages
摘要
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).
申请公布号
US6150828(A)
申请公布日期
2000.11.21
申请号
US19990400515
申请日期
1999.09.20
申请人
MICRON TECHNOLOGY, INC.
发明人
FARNWORTH, WARREN M.;WOOD, ALAN G.;JACOBSON, JOHN O.;HEMBREE, DAVID R.;WARK, JAMES M.;FOLARON, JENNIFER L.;FOLARON, ROBERT J.;NELSON, JAY C.;WARREN, LELAN D.