| 发明名称 |
CALIBRATING THERMAL BEHAVIOR OF ELECTRONICS |
| 摘要 |
A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship. |
| 申请公布号 |
US2016252408(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201615154448 |
申请日期 |
2016.05.13 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Chainer Timothy J.;Parida Pritish R.;Schultz Mark D. |
| 分类号 |
G01K15/00;G01K7/02 |
主分类号 |
G01K15/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A calibration method for a component dissipating heat into a coolant cooled apparatus, the method comprising:
determining a heat dissipation of said component; determining a thermal resistance from said component to a coolant; determining a measured temperature of said component according to said heat dissipation and said thermal resistance at a plurality of time stamps included in thermal data output by said component; and determining a relationship between said measured temperature and said thermal data for said component. |
| 地址 |
Armonk NY US |
