发明名称 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain an electroconductive resin composition that does not sacrifices moldability, especially fluidity and heat stability and is inexpensive by developing high electroconductivity with a small amount of electroconductive carbon and a molding molded from the composition. SOLUTION: The electroconductive resin composition comprises a polyamide resin, a polyphenylene ether resin and electroconductive carbon and has &le;10<SP>7</SP>&Omega;&times;cm volume resistivity value. The polyamide resin comprises a polyamide resin [A] in which the numbers n of repetitions of methylene group represented by formula (1) existing in the repeating units are wholly &le;6 and a polyamide resin [B] in which at least one of the numbers n of repetitions of methylene group represented by formula (1) existing in the repeating units is &ge;7. The molding comprises the composition. COPYRIGHT: (C)2005,JPO&amp;NCIPI
申请公布号 JP2005206688(A) 申请公布日期 2005.08.04
申请号 JP20040014427 申请日期 2004.01.22
申请人 ASAHI KASEI CHEMICALS CORP 发明人 TANAKA YUJI
分类号 C08L77/00;C08K3/04;C08L21/00;C08L71/12;(IPC1-7):C08L77/00 主分类号 C08L77/00
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