FILM DEPOSITION METHOD, AND FILM DEPOSITION APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a film deposition method for shortening the time period required for a step of suction or exhaustion in a process chamber for executing a deposition process thereby to make a deposition action efficient.SOLUTION: A film deposition apparatus 10 comprises: a vacuum chamber 20; a table 21 disposed in the vacuum chamber 20; a placing part disposed at the table 21 and having a placing face; a side wall member 32 fixed at the table 21 in a manner to surround the placing face; a gas supply part 24 for supplying a process gas; a lid part for closing a first opening at the end part of the side wall part 32; and a drive part for moving the table. A film deposition method comprises: a first step of placing a substrate on the placing face; a second step of moving the side wall part 32 to the vicinity of the lid part so that a space over the placing face is separated gas-tightly thereby to form a process chamber 30; a third step of feeding the process gas to the process chamber 30; and a fourth step of releasing the sealed state of the process chamber 30 by the lid part.SELECTED DRAWING: Figure 1