Semiconductor light emitting device and semiconductor light emitting device package using the same

摘要

A semiconductor light emitting device includes a multi-region solder pad. The semiconductor light emitting device includes a light emitting diode (LED) chip having a first surface on which first and second electrodes are disposed and a second surface opposing the first surface. A passivation layer is disposed on a surface of the LED chip such that bonding regions of the first and second electrodes are exposed through the passivation layer. A solder pad is disposed in each respective bonding region and has a plurality of separated regions. A solder bump is disposed in each respective bonding region and covers the plurality of separated regions of the respective solder pad. In the semiconductor light emitting device, separation between the solder pad and the solder bump may thereby be effectively prevented by ensuring that an interface between a solder pad and a solder bump is not entirely damaged.

主权项

1. A semiconductor light emitting device comprising:
a light emitting diode (LED) chip having a first surface on which first and second electrodes are disposed and a second surface opposing the first surface; a passivation layer disposed on a surface of the LED chip such that bonding regions of the first and second electrodes are exposed through the passivation layer; a plurality of solder pads, each solder pad disposed in a respective bonding region of the bonding regions and having a plurality of separated regions; and a plurality of solder bumps, each solder bump disposed in a respective bonding region of the bonding regions and covering the plurality of separated regions of the solder pad disposed in the respective bonding region.