| 摘要 |
<p>A molded semiconductor device (24) having greater resistance to package cracking during board mounting in addition to increased thermal performance is provided wherein the device has a reduced semiconductor die to flag interface and a drop-in heat sink. The semiconductor die (12) is mounted on a leadframe (16) having a flag (15) with an opening to expose a substantial portion of the inactive surface (14) of the die (12). Decreasing the interfacial contact area between the die (12) and the flag (15) reduces the risk of package cracking during board mounting by limiting the area where delamination typically occurs. An encapsulant (22) forms a package body which encompasses an opening (23) to expose a substantial portion of the inactive surface (14) of the semiconductor die (12). A heat sink (26) is inserted into the opening (23), directly coupling the heat sink (26) to the die (12), after the semiconductor package is mounted onto a printed circuit board. <IMAGE></p> |
