| 摘要 |
PROBLEM TO BE SOLVED: To prevent the deterioration of inspection performance, when using an electron beam, caused by a difference in contrast between inspection images owing to a difference in kind or density of an intra-chip circuit pattern in a specimen, as to an inspection device for detecting a defect by using an electron beam. SOLUTION: According to this inspection method or device using a charged particle beam, at least two images obtained by scanning the specimen by means of the charged particle beam are compared with each other to extract a defect in the circuit pattern in the specimen. The specimen is continuously moved while a predetermined width is scanned by means of the particle beam. Inspection conditions are changed to obtain images in areas where circuit patterns are different in kind or density. COPYRIGHT: (C)2005,JPO&NCIPI
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