MANUFACTURING METHOD FOR SEMICONDUCTOR CHIPS

摘要

The semiconductor chip manufacturing process is carried out in processes including a protective sheet sticking process for sticking a protective sheet onto a first surface of a semiconductor wafer so that the sheet comes in contact with the TEG, a mask placing process for placing a mask on a second surface that is a surface opposite from the first surface, a plasma etching process for performing plasma etching from the second surface to remove portions corresponding to dividing regions and separate device-formation-regions into individual semiconductor chips, and a TEG removing process for removing the TEG in a state where it remains unremoved in the dividing regions and stuck to the protective sheet together with the protective sheet by peeling off the protective sheet.