SUB-MOUNT AND SEMICONDUCTOR DEVICE EQUIPPED WITH IT

摘要

PROBLEM TO BE SOLVED: To provide a sub-mount which enhances heat dissipation characteristics and the contour precision. SOLUTION: The sub-mount 10 is provided with an aluminum nitride layer 11 containing aluminum nitride particles having a mean particle diameter of about 30-50μm, and an aluminum nitride layer 12 arranged on the aluminum nitride layer 11 and containing aluminum nitride particles having a mean particle diameter of about 5-20μm. COPYRIGHT: (C)2009,JPO&INPIT