| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive composition suitable for forming a conductive pattern with high conductivity, an electronic device using the same, and a manufacturing method of the electronic device, and at the same time, to provide a conductive composition capable of preventing silver migration, and oxidation at use of copper, an electronic device using the same, and a manufacturing method of the electronic device. SOLUTION: The conductive composition for a conductor pattern contains resin, and conductive metal particles. The conductive metal particles contain high-melting-point metal particles and low-melting-point metal particles. The high-melting-point metal particles contain at least one selected from a group of Ag, Cu, Au, Pt, Ti, Zn, Al, Fe, Si, and Ni. The low-melting-point metal particles contain at least one selected from a group of Sn, In, and Bi. COPYRIGHT: (C)2009,JPO&INPIT
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