SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

According to one embodiment, a semiconductor manufacturing apparatus includes a cover part, a gas introduction part provided in the cover part, and a shower plate. The shower plate includes a space, a bottom part, and an outer frame part, the space being provided by jointing the shower plate with the cover part, the space being capable of containing a gas introduced from the gas introduction part, the outer frame part surrounding the bottom part, the bottom part including a plurality of ejection ports to eject the gas, a first cooling path being disposed between the ejection ports and the cover part in a center part of the bottom part, and a second cooling path disposed between the ejection ports and the cover part in an outer peripheral part of the bottom part surrounding the center part, the second cooling path being not connected with the first cooling path

主权项

1. A semiconductor manufacturing apparatus comprising:
a cover part; a gas introduction part provided in the cover part; and a shower plate including a space, a bottom part, and an outer frame part, the space being provided by jointing the shower plate with the cover part, the space being capable of containing a gas introduced from the gas introduction part, the outer frame part surrounding the bottom part, the bottom part including a plurality of ejection ports to eject the gas, a first cooling path being disposed between the ejection ports and the cover part in a center part of the bottom part, and a second cooling path disposed between the ejection ports and the cover part in an outer peripheral part of the bottom part surrounding the center part, the second cooling path being not connected with the first cooling path.