| 摘要 |
A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component, a gimbal and a plurality of fixing pieces. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the loading component and the head component to support the gap therebetween. The fixing pieces run through the loading component and nail down the head component, wherein the fixing pieces can slide correlatively to the loading component. |
