| 发明名称 |
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND OPTICAL DEVICE |
| 摘要 |
A method of manufacturing a printed circuit board, the method includes: forming an electrode layer on one surface of a substrate; forming a through hole that penetrates the substrate and the electrode layer, wherein an inner diameter of the through hole in the electrode layer is smaller than an inner diameter of the through hole in the substrate; dropping a curable liquid that has a liquid-repellency with respect to the substrate, on a substrate portion in the through hole from an opposite side to the electrode layer; and curing the liquid dropped on the substrate portion in the through hole to form a lens. |
| 申请公布号 |
US2016349469(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615131398 |
申请日期 |
2016.04.18 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KASE Mariko |
| 分类号 |
G02B6/42;B29C39/02;H01S5/183;B29C35/08;G02B6/32;G02B6/138 |
主分类号 |
G02B6/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a printed circuit board, the method comprising:
forming an electrode layer on one surface of a substrate; forming a through hole that penetrates the substrate and the electrode layer, wherein an inner diameter of the through hole in the electrode layer is smaller than an inner diameter of the through hole in the substrate; dropping a curable liquid that has a liquid-repellency with respect to the substrate, on a substrate portion in the through hole from an opposite side to the electrode layer; and curing the liquid dropped on the substrate portion in the through hole to form a lens. |
| 地址 |
Kawasaki-shi JP |
