发明名称 NON-LEAD GLASS FINE PARTICLE-DISPERSED PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a non-lead glass fine particle-dispersed paste composition which can be applied suitably when used as a non-lead glass sealing material, hardly generates residual carbon after sintered and can be degreased even in a low-temperature atmosphere. SOLUTION: The non-lead glass fine particle-dispersed paste composition to be used as the non-lead glass sealing material includes: a binder resin, which contains 40-95 wt.% segment derived from isobutyl methacrylate and 5-40 wt.% segment derived from polyoxyalkylene ether monomethacrylate; an organic solvent; and a non-lead glass fine particle. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084108(A) 申请公布日期 2009.04.23
申请号 JP20070255433 申请日期 2007.09.28
申请人 SEKISUI CHEM CO LTD 发明人 MIYAZAKI HIROKO;YAMAUCHI KENJI;FUKUI KOJI;HIRAIKE HIROYUKI;MORIGUCHI SHINTARO
分类号 C03C8/16 主分类号 C03C8/16
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