| 摘要 |
The present invention relates to a compression resin packaging method and a compression resin packaging device for electronic components. The present invention simplifies the compression resin packaging device which integrally packages the electronic components on a large-scale substrate and resin in a package, and raises precision (deviation) of thickness of the package. Sheet-like resin having a shape-preserving property carried on a release liner is supplied into a lower mold cavity, mold assembling is performed for upper and lower molds, residual resin in the lower mold cavity is leaded into a residual resin containing part at the outside world through a gap between the upper mold and the lower mold, so that in a resin packaging step, a gap between a bottom surface of the lower mold cavity at a final position of the mold assembling of the upper and lower molds and an electronic component installing surface in the large-scale substrate is set to be equal to the gap of the package thickness for performing resin packaging for the electronic components of the large-scale substrate, by further compressing the fused resin material in the lower mold cavity under the conditions of low speed and low pressure, the electronic components on the large-scale substrate are packaged integrally with the resin. |
