FLEXIBLE CIRCUIT CLAD LAMINATE, PRINTED CIRCUIT BOARD USING IT, AND METHOD OF MANUFACTURING THE SAME

摘要

According to an embodiment of the present invention, a flexible circuit clad laminate comprises: a resin layer; an adhesion reinforcing layer formed on at least one surface of the resin layer by a pre-treatment work, containing silane; a tiecoat layer formed on the adhesion reinforcing layer containing the silane; and a copper layer formed on the tiecoat layer.