| 发明名称 |
POLISHING APPARATUS, METHOD FOR CONTROLLING THE SAME, AND METHOD FOR OUTPUTTING A DRESSING CONDITION |
| 摘要 |
A polishing apparatus includes: a turntable for supporting a polishing pad; a turntable rotation mechanism configured to rotate the turntable; a dresser configured to dress the polishing pad; and a scanning mechanism configured to cause the dresser to scan between a first position and a second position on the polishing pad, wherein Ttt/Tds and Tds/Ttt are a non-integer where the Ttt is a rotation cycle of the turntable during dressing, and the Tds is a scanning cycle during which the dresser scans between the first position and the second position. |
| 申请公布号 |
US2016271749(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615071091 |
申请日期 |
2016.03.15 |
| 申请人 |
EBARA CORPORATION |
发明人 |
SHINOZAKI Hiroyuki |
| 分类号 |
B24B37/005 |
主分类号 |
B24B37/005 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing apparatus comprising:
a turntable for supporting a polishing pad; a turntable rotation mechanism configured to rotate the turntable; a dresser configured to dress the polishing pad; and a scanning mechanism configured to cause the dresser to scan between a first position and a second position on the polishing pad, wherein Ttt/Tds and Tds/Ttt are a non-integer where the Ttt is a rotation cycle of the turntable during dressing, and the Tds is a scanning cycle during which the dresser scans between the first position and the second position. |
| 地址 |
Tokyo JP |
