发明名称 Modular interconnect structure
摘要 Some embodiments of the invention include an interconnect structure to transfer data among a plurality of devices. The interconnect structure includes a crossbar and a number of interconnect branches coupled to the crossbar. Each of the interconnect branches includes a number of connector circuits coupled in series to transfer data in a group of devices of the plurality of devices. The crossbar includes a number of connector circuits coupled in series to allow one group of devices from one interconnect branch to exchange data with another group of devices from another interconnect branch. Other embodiments are described and claimed.
申请公布号 US2006221984(A1) 申请公布日期 2006.10.05
申请号 US20050095241 申请日期 2005.03.31
申请人 INTEL CORPORATION 发明人 DENHAM MARTIN S.
分类号 H04L12/28 主分类号 H04L12/28
代理机构 代理人
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