| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit connecting method sufficiently reducing the connection resistance between circuit electrodes that are electrically connected via an anisotropic conductive film for circuit connection. <P>SOLUTION: The circuit connecting method includes the steps of: preparing a circuit member 12 that includes a circuit electrode 12b formed on a glass substrate 12a; preparing a flexible wiring board 14 that includes a circuit electrode 14b formed on a base material 14a and on which a solder resist 18 is provided on a part of the circuit electrode 14b except for a part connected to the circuit electrode 12b; and bonding the circuit member 12 and the flexible wiring board 14 via an anisotropic conductive film 16 for circuit connection so that part of the anisotropic conductive film 16 for circuit connection overlaps part of the solder resist 18. A thickness h3 of the anisotropic conductive film 16 for circuit connection is less than or equal to the total of a height h1 of the circuit electrode 12b and a height h2 of the circuit electrode 14b. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
