Low Thermal Resistance, Stress-Controlled Diode Laser Assemblies

摘要

A diode laser bar assembly is formed to exhibit a relatively low thermal resistance, which also providing an increased range of conditions over which the internal stress conditions may be managed. In particular, the submount configuration of the prior art is replaced by a pair of platelets, disposed above and below the diode laser bar so as to form a “sandwich” structure. The bottom platelet is disposed between the heatsink (cooler) and the diode laser bar. Thus, the bottom platelet may be relatively thin, creating a low thermal resistance configuration. The combination of the top and bottom platelets provides the ability to create various configurations and designs that best accommodate stress conditions for a particular situation.

主权项

1. A diode laser bar assembly comprising
a bar of semiconductor laser diodes including an array of emitter regions disposed in a lateral direction across a front facet of the bar, the bar including a bottom major surface and an opposing top major surface, the front facet extending orthogonally between the top and bottom major surfaces; a heatsink; a bottom platelet disposed between the heatsink and the bottom major surface of the bar of semiconductor laser diodes, the bottom platelet providing heat flow from the bar of semiconductor laser diodes to the heatsink in a direction perpendicular to the major surfaces of the bar of semiconductor laser diodes, with the bottom platelet affixed in place using a suitable solder material; and a top platelet disposed over and affixed to the top major surface of the bar of semiconductor laser diodes, the dimensions and materials selected for the bottom platelet and the top platelet chosen to create a low thermal resistance path between the bar of semiconductor laser diodes and the heatsink, while also managing stress conditions within the assembly.