| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized semiconductor package with semiconductor devices which reduce its plane area up to a minimum area. SOLUTION: A resist film 14 in this small-sized semiconductor package covers the surface of a substrate 12. The resist 14 is formed such that it covers in an opening at the substrate surface-side of a through-hole electrode 12a provided on the substrate 12. A semiconductor device 16 is so arranged as to overlap the substrate surface-side opening of the through-hole electrode 12a, and is connected from a window 14c to an electrode pattern 12c on the substrate 12. Since the semiconductor device 16 and the through-hole electrode 12a are arranged such that they overlap each other, the outer shape of the substrate 12 is made small to make the total semiconductor package smaller. COPYRIGHT: (C)2006,JPO&NCIPI |
