| 摘要 |
A semiconductor manufacturing apparatus having a hoop for lifting a wafer is provided to prevent the wafer from being slid on a plate by forming a coupling groove on a lift pin. A semiconductor manufacturing apparatus includes a process chamber(100), a susceptor(110), at least one pin(115), and a hoop(120). The susceptor is arranged inside the process chamber and supports the wafer. The pin penetrates a predetermined portion of the susceptor and lifts up the wafer. The hoop is installed at a lower portion of the susceptor, substantially lifts the pin, and includes a groove for fixing the pin. The susceptor includes a plate and a cylinder. The wafer is mounted on the plate. The cylinder supports the plate. The hoop is a hook shape. The cylinder is inserted into the hoop.
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