| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ball attachment device precisely attaching a solder ball to each ball land of a substrate even with the occurrence of warpage, and also to provide a solder ball attachment method using the same. <P>SOLUTION: A ball attachment device 400 is provided with a plurality of ball lands to attach a solder ball to each ball land of a material with mold caps formed between the ball lands. The ball attachment device 400 comprises: an index 410 which the material safely arrives at and is fixed to; a holder 420 arranged in the upper part of the index 410 to ascend and descend; an attachment plate that is installed on the lower surface of the holder 420 and provided with a projection part in the part corresponding to the mold cap of the material and a groove for mounting the solder ball in the part corresponding to the ball land of the material; and an eject pin that is installed in each groove of the attachment plate 422 to transfer and drop the solder balls by vacuum and vacuum release. <P>COPYRIGHT: (C)2008,JPO&INPIT |
