| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method, wherein the unwanted substrate of the surface of a substrate is excluded while preventing a readhesion to the substrate. SOLUTION: The flow velocity vector V2 of a treatment agent flowing on the surface of a wafer W after a delivery from a second nozzle 3 is opposed to the flow velocity vector V1 of the treatment agent flowing on the surface of the wafer W after a delivery from a first nozzle 2. Also, the first nozzle 2 and the second nozzle 3 are provided so that a touch-down location (incident location) P1 on the surface of the wafer W of the treatment agent delivered from the first nozzle 2 and a touch-down location (incident location) P2 on the surface of the wafer W of the treatment agent delivered from the second nozzle 3 are shifted to a direction perpendicular to the flow velocity vector V1. COPYRIGHT: (C)2006,JPO&NCIPI
|
