| 摘要 |
PROBLEM TO BE SOLVED: To perform heat treatment by a simple structure in a short time without reducing the throughput of an apparatus even if a treatment temperature difference exists between successively heat-treated semiconductor wafers. SOLUTION: The apparatus and the method for manufacturing semiconductor can carry out the heat treatment by the simple structure in a short time without reducing the throughput of the apparatus even if the treatment temperature difference exists between successively heat-treated semiconductor wafers by comprising a chamber for heat-treating the semiconductor wafer, a heat source for heating the semiconductor wafer, supporting pins on which the semiconductor wafer is mounted, and a vertically movable cover installed above the supporting pins. COPYRIGHT: (C)2007,JPO&INPIT
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