| 发明名称 |
Substrate having laser sintered underplate |
| 摘要 |
A substrate includes a metal portion and an underplate that is laser sintered to the metal portion. The metal portion has a melting point that is lower than a sintering temperature of the underplate. |
| 申请公布号 |
US9346114(B2) |
申请公布日期 |
2016.05.24 |
| 申请号 |
US201012913839 |
申请日期 |
2010.10.28 |
| 申请人 |
AEROJET ROCKETDYNE OF DE, INC. |
发明人 |
Hertel Thomas A. |
| 分类号 |
B22F3/105;B23K1/00;B22F7/04;B32B15/01;H01L23/00 |
主分类号 |
B22F3/105 |
| 代理机构 |
|
代理人 |
Landau Joel G |
| 主权项 |
1. A substrate comprising:
a metal portion; and a metallic underplate of nickel metal that is laser sintered to the metal portion such that the metallic underplate has a sintered interface with the metal portion, the sintered interface having a microstructure that is characteristic of being laser-applied and does not crack, blister or delaminate at a processing temperature greater than 350° C., wherein the metal portion has a melting point that is lower than a sintering temperature of the metallic underplate. |
| 地址 |
Canoga Park CA US |
