SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF STACKING MEMORY ELEMENTS ON SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device.SOLUTION: A semiconductor device includes a die coupled to a substrate, a first memory device coupled to a surface of the die opposite the substrate, and a coupling device coupled between the surface of the die opposite the substrate and a second memory device such that the second memory device at least partially overlaps the first memory device. Also disclosed is a method of mounting first and second memory devices on a die in an at least partially overlapping manner.SELECTED DRAWING: Figure 5