| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent that noise is superimposed on a signal. <P>SOLUTION: A semiconductor chip is mounted on a first surface 102 of a first wiring substrate 100. The first surface 102 of the first wiring substrate 100 has a first ground plane 120, first wiring 132 for signal 132, first wiring 134 for ground, and first wiring 136 for power-supply potential, in addition to a bonding electrode 110. The first wiring 134 for ground extends so as to be adjacent to the first wiring 132 for signal and connects a bonding electrode 114 for ground to the first ground plane 120. Hole wiring 144 for ground is adjacent to hole wiring 142 for signal. The hole wiring 144 for ground connects the first ground plane 120 to second wiring for ground provided on a second surface 104. <P>COPYRIGHT: (C)2013,JPO&INPIT |
