| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve an electronic module which does not use an outer layer case and can be made compact easily. <P>SOLUTION: An electronic module 10 has a planar card-shape and includes a wiring board 12, an electronic component 11 mounted on the wiring board 12, a connection terminal 13, and an outer layer 15. The electronic component 11 is a chip component such as a resistor or a capacitor, or an IC (integrated circuit). The connection terminal 13 is connected electrically with the terminal of a connected module. The outer layer 15 is a prepreg, and a glass cloth impregnated with thermosetting resin such as epoxy resin is used. <P>COPYRIGHT: (C)2013,JPO&INPIT |
