| 摘要 |
PROBLEM TO BE SOLVED: To provide a flux based on an inorganic boron compound and/or a halide-compound for soldering of a hardly wettable metallic material by the use of a brazing material based on silver and copper. SOLUTION: This flux includes, as an active additive, elemental boron of 0.01 to 10 mass %, and at least one of Mo, W, Mn, Co, Ni, Pd, Cu or Ag in the form of an element, an alloy or a compound, of 0.01 to 10 mass %, with respect to the total amount of the flux. Thus the active additive remarkably improves the wettability of the soldering material in the case of a hardly wettable base material.
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