发明名称 |
Semiconductor package and semiconductor system including the same |
摘要 |
Provided are a semiconductor package and a semiconductor system including the semiconductor package. The semiconductor package includes a semiconductor device and an interconnect structure electrically connected to the semiconductor device and delivering a signal from the semiconductor device, wherein the interconnect structure includes an anodized insulation region and an interconnect adjacent to and defined by the anodized insulation region.
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申请公布号 |
US8466558(B2) |
申请公布日期 |
2013.06.18 |
申请号 |
US201113234175 |
申请日期 |
2011.09.16 |
申请人 |
YOO JAE-WOOK;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOO JAE-WOOK |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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