Compensation Of Bondwires In The Microwave Regime

摘要

A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.

主权项

1. A method for interfacing an IC to a PCB for a device, comprising the steps of:
A) fixing said IC to a dielectric substrate; B) fastening said PCB to said substrate; C) bonding said IC to said PCB with a wire bond; D) establishing a ground plane for said PCB; and, E) defecting said ground plane.