| 主权项 |
1. A wafer divider comprising:
a placement table on which a wafer is placed, the wafer having a device formed in each of areas partitioned by scheduled division lines, with division start points formed along the scheduled division lines; and division means adapted to divide the wafer on the placement table into a plurality of device chips starting from the division start points, wherein the placement table includes
a plurality of spherical bodies having same diameter,a container that accommodates the plurality of spherical bodies in close contact with each other, anda placement surface formed by connecting vertices of spherical surfaces of the plurality of spherical bodies that are accommodated in close contact with each other, the division means includes
pressing means adapted to press the wafer placed on the placement surface toward the placement surface,elevating means adapted to raise or lower the pressing means, andparallel movement means adapted to move the pressing means and the placement table relatively parallel along the placement surface, wherein the wafer on the placement table is divided into individual device chips by pressing the wafer with the pressing means. |
