发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device for which a conductive layer constituting particles will not diffuse into an insulating layer, even if the width of the conductive layer is widened. SOLUTION: This semiconductor device is provided with an insulating layer 2, a barrier layer 4, a conductive layer 5, a barrier layer 6 having an aperture part 11, and insulating layer 7 having a through-hole 8, with which the surface of the conductive layer 5 and a part of the surface of the barrier layer 6 are made to be exposed, a barrier layer 9 which is formed on the side face of the through-hole 8 and on the insulating layer 7 and comes into contact with the upper surface 6a of the barrier layer 6, and a conductive layer 10 with which the aperture part 11 and the through-hole 8 are filled. Since all the parts of the conductive layers 5 and 10 come in contact with the barrier layers 4, 6 and 9 in this semiconductor device, the copper contained in the conductive layers 5 and 10 will not diffuse into silicon dioxide which constitutes the insulating layers 2 and 7.</p>
申请公布号 JPH11317446(A) 申请公布日期 1999.11.16
申请号 JP19980122289 申请日期 1998.05.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORI TAKESHI;TOYODA YOSHIHIKO;FUKADA TETSUO;KITAZAWA YOSHIYUKI
分类号 H01L21/768;H01L23/532;(IPC1-7):H01L21/768 主分类号 H01L21/768
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