| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure of an electronic component which enables improvement of the efficiency of radiating heat generated from an electronic component, compared to a structure in which an electronic component is not housed in a recessed part and is mounted on a substrate, and to provide a communication module having the heat radiation structure of the electronic component.SOLUTION: A communication module 100 includes: a substrate 1 having a first surface 1a and a second surface 1b provided at the opposite side of the first surface 1a; a recessed part 11 provided on the first surface 1a of the substrate 1 and in which a plating layer 110 is formed on an inner surface; a driver IC3 which is one example of an electronic component housed in the recessed part 11 of the substrate 1; and an adhesive 5 which is disposed between the plating layer 110 of the recessed part 11 of the substrate 1 and the driver IC3, bonds the driver IC3 to the plating layer 110 of the recessed part 11, and has heat conductivity.SELECTED DRAWING: Figure 2 |
