| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heating device capable of suppressing an increase in cost.SOLUTION: A substrate heating device 10 comprises a processing chamber 11 which houses a wafer W, a stage 12 arranged inside the processing chamber 11, and a microwave antenna 13 which emits a microwave toward the inside of the processing chamber 11. The processing chamber 11 includes a substantially cylindrical body part 15, and a laid-down hemispherical dome part 16 covering an upper part of the body part 15. When a microwave is emitted from the microwave antenna 13, the wafer W moves inside the processing chamber 11 in a vertical direction.SELECTED DRAWING: Figure 8 |
