| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board, by which the step of roughening a conductor layer can be simplified.SOLUTION: A method for manufacturing a wiring board according to the present invention, which is arranged to put green sheets on one another, press-fit them into a green sheet body, bake the green sheet body and consequently form a baked substrate, comprises the steps of: performing the press-fitting of the green sheet body by a press-fit jig of which the face for abutting against a surface of the green sheet body is roughened; forming, on the baked substrate, a first conductor layer which makes a seed layer; forming, on the first conductor layer, a resist layer with a predetermined pattern of opening; and forming a second conductor layer on part of the first conductor layer, which is exposed from the opening by electrolytic plating.SELECTED DRAWING: Figure 1 |
